Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (32권4호 487-495)

Electroless Ni Plating on Pb-base Ceramics

Pb계 Ceramics 기지상의 무전해 Ni 도금

민봉기;유종수;최순돈;신현준;
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영남대학교 공과대학 금속 및 재료공학부;영남이공대학 금속·금형설계과;
영남대학교 공과대학 금속 및 재료공학부;영남이공대학 금속·금형설계과;

Abstract

In order to form metallic electrodes on PZT (Pb (Zr, Ti)O$_3$) ceramics, plating conditions for optimal electroless Ni deposition were investigated. Pb in PZT is the major component to inhibit the electroless deposition, because it plays a active role of catalytic poison in plating solution. Adhesion of the electroless Ni deposits is measured by push-pull scale test and peel test. Results such as deposition ability, deposition rate, and thickness of deposits showed in terms of concentration of etchant, composition of catalyzing solution, and composition and pH of electroless bath solution.

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