Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


공학

한국표면공학회지 (32권3호 423-427)

Plating of Permalloy Using Flow Cell

Plating of Permalloy Using Flow Cell

;;;
Jeon, S.H.;Ahn, J.H.;Kang, T.;

School of Materials Science and Engineering, Seoul National University;
School of Materials Science and Engineering, Seoul National University;

Abstract

Electroplating of 80%Ni permalloy thin plate for magnetic core materials. was studied The convected flow of electrolyte was used for stirring methode. The current density could be increased up to 250mA/$ extrm{cm}^2$ by flow cell. The composition of electroplated layer with vespect to current density and flow rate was investigated and experimental equation to predict the composition was made. How cell yielded more uniform thickness distribution than paddle cell did. The composition distribution was also studied. The thickness was the most important factor to the permeability. The permeability of 5$mu extrm{m}$plated permalloy was over 2000 at 1 MHz.

Keywords

flow cell;permalloy;electroplating;soft magnetic material;permeability;