Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


한국표면공학회지 (15권1호 11-18)

An Electrochemical Analysis on the Alloy Deposition of 80Ni-20Fe Permalloy Thin Film

80Ni-20Fe Permalloy 박모 동시석출 기구에 관한 전기화학적 고찰

Lee, K. H.;Kang, Tak;Ra, H. Y.;

서울대 공과대학 금속공학과 대학원;서울대 공과대학 금속공학과;
Graduate School S.N.U.;Faculty, College of Eng. S.N.U.;


80% Ni-Permalloy is soft magnetic material with high initial permeability and low magnetic coercive force Hc, and is used to computer memory cores and minirelays of communication e-ngineering. In this paper 80 Permalloy thin film on copper cathode was alloy-deposited from Watts so-lution contatining FeSO4$.$7H2O. The amount of FeSO4$.$7H2O in the solution, pH, temperature of the solution and plating current density were varied as parameters and the resulting comp-osition changes of deposited film were analyzed electrochemically with respect to the parame-ters. From the above procedure electroplating conditions for deposition of 80 Permalloy were est-ablished as following: 17-21 g/$ell$ of FeSO4$.$7H2O in Watts solution, current density 1.0-2.0 Amp/dm2, pH 2.5-3.0 and temperature range of 50-60$^{circ}C$.