Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


한국표면공학회지 (28권5호 309-319)

Metallization on Patterned Substrate

패턴된 기판에 금속 배선 형성


서울대학교 금속공학과;연세대학교 금속공학과;
서울대학교 금속공학과;연세대학교 금속공학과;


The substrate patterned with the dry film has the cavity which has the $90^{circ}$ wall angle. Electroplating Cu on this patterned substrate has the differrent shape history with the electrochemical parameters. By potential theory model, the reason of the variation of the shape change with the these parameters was investigated. The shape history could be explained by the current flow and the correlated area effects. By embedding the Ni layer between the Cu layers, shape history with the time was obtained experimentally and the results was compared with the numerical analysis by BEM. The adhesive Cr-Cu film in TAB application was etched with the various condition. The best condition for the etchant of the Cr-Cu film was found.