Korean Institute of Surface Engineering

pISSN : 1225-8024 | eISSN : 3399-8403


한국표면공학회지 (39권6호 255-262)

The Effect of Cu Reflow on the Pd-Cu Alloy Membrane Formation for Hydrogen Separation

수소분리용 Pd-Cu 합금 분리막의 Cu Reflow 영향

Mun, Jin-Uk;Kim, Dong-Won;

경기대학교 재료공학과;
Department of Advanced Materials Engineering, Kyonggi University;


Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.


Cu reflow;Oxidized Si support;Pd-Cu alloy hydrogen membrane;Sputtering deposition;Hydrogen separation;